WENDU Thermalright Thermal Pad with 12.8 W/mK Conductivity, 85x45x1.5mm Size, and Non-Conductive for PC, PS5, and Laptop Heatsinks to Improve Cooling Efficiency

4 out of 5

$17.99

WENDU Thermalright Thermal Pad with 12.8 W/mK Conductivity, 85x45x1.5mm Size, and Non-Conductive for PC, PS5, and Laptop Heatsinks to Improve Cooling Efficiency

computer heat sink compound

Premium Thermal Pad for Efficient Cooling

Upgrade your cooling game with our advanced thermal silica gel pad, boasting an impressive thermal conductivity of 12.8 W/mK. Engineered to enhance heat transfer between electronic components, it rapidly reduces temperatures for optimal performance. Its high-quality design ensures reliability across a wide temperature range of -40°C to 200°C, offering non-toxic, odorless, and anti-static properties.

Crafted for convenience, our thermal pad measures 85x45x1.5mm and can be easily cut to fit your specific needs—perfect for filling surface gaps on various devices. Ideal for PCs, control boards, CPUs, GPUs, and more, it’s a versatile replacement for traditional heatsink compounds.

Buy with confidence—our thermal pads are durable, easy to install, and backed by our commitment to quality. Contact us for any assistance and experience the unmatched cooling efficiency for yourself!

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Description

Discover the efficiency of the Thermalright Thermal Pad 1.5mm, designed to tackle your cooling challenges with ease and reliability. This thermal pad is perfect for enhancing heat transfer in your PC, PS5, PS4, laptop, heatsink, GPU, CPU, SSD, VRAM, and LED coolers.

Features:

  • Material: Upgraded thermal silica gel with a thermal conductivity of 12.8 W/mK. It ensures superior heat dissipation, quickly cooling down your hardware.
  • Reliability: Operates effectively in -40℃ to 200℃ temperatures. This durable pad is non-toxic, odorless, anti-corrosive, anti-static, and fire retardant. Its excellent insulation ensures no electrical damage.
  • Ease of Use: Measuring 85x45x1.5mm, this pad can be easily cut to fit various sizes, making it ideal for both beginners and professionals who need to fill gaps on contact surfaces.
  • Versatility: A great alternative to traditional heatsink compound grease paste. Suitable for PC components, control boards, motors, electronics, CPUs, GPUs, heat sinks, power LEDs, gaming equipment, and more.

Enhance your device’s performance and longevity with the Thermalright Thermal Pad. It’s a simple, effective solution for overheating issues, ensuring your equipment runs smoothly without the risk of damage.

Additional information

Brand

WENDU
Product Dimensions

3.35"L x 1.77"W x 0.06"H
Mounting Type

Chassis Mount
Manufacturer

WENDU
UPC

723496990364
POSITIVE:
Effective Cooling

Some users reported significant temperature drops, such as from 75°C to 60°C, or 40°C to 55°C, proving the pad's cooling efficiency.
Versatile Applications

The pad was successfully used on various devices, including PS3, PS4, MacBook Air, and GPUs, showing its broad compatibility.
Easy Customization

Users were able to cut the pads to fit their specific needs, making it adaptable to different hardware dimensions.
Good Quality Material

Positive reviews indicate that the quality of the material met or exceeded expectations.
Reliable Performance

For overclocking purposes, this thermal pad was preferred over factory-installed ones, offering better thermal management.
Satisfaction in Performance

Consistent satisfaction with the product's effectiveness and application process.
NEGATIVE:
Difficult to Remove Protective Film

Many users struggled with removing the protective film without damaging the thermal pad.
Brittle and Tear-Prone Material

The thermal pads were reported to be brittle, making installation problematic as they could crumble or deform easily.
Inconsistent Performance

Some users experienced worse performance with these pads, leading to higher temperatures in devices like GPUs and CPUs.
Not Suitable for High-End Applications

Specifically for higher-end GPUs or CPUs, the pads were ineffective, sometimes causing overheating.
Variable Thickness Issues

Difficulty in maintaining the pad's original thickness during application led to inconsistent results.
Limited Applicability

The product was not useful in precise applications due to its fragility and issues with thickness consistency.

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